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I downloaded and installed Intel oneAPI base Toolkit, followed by Intel oneAPI HPC Toolkit with the hope that, since Intel Parallel Studio XE 2019 or so are integrated in Intel oneAPI HPC Toolkit, I wouldn't have any issue.
The reliability of electronic assemblies is largely affected by the health of interconnects, such as solder joints, which provide mechanical, electrical and thermal connections between circuit components. During field lifecycle conditions, interconnects are often subjected to a DC open circuit, one of the most common interconnect failure modes, due to cracking. An interconnect damaged by cracking is sometimes extremely hard to detect when it is a part of a daisy-chain structure, neighboring with other healthy interconnects that have not yet cracked. This cracked interconnect may seem to provide a good electrical contact due to the compressive load applied by the neighboring healthy interconnects, but it can cause the occasional loss of electrical continuity under operational and environmental loading conditions in field applications. Thus, cracked interconnects can lead to the intermittent failure of electronic assemblies and eventually to permanent failure of the product or the system. This paper introduces a model-based prognostic approach to quantitatively detect and predict interconnect failure using impedance analysis and particle filtering. Impedance analysis was previously reported as a sensitive means of detecting incipient changes at the surface of interconnects, such as cracking, based on the continuous monitoring of RF impedance. To predict the time to failure, particle filtering was used as a prognostic approach using the Paris model to address the fatigue crack growth. To validate this approach, mechanical fatigue tests were conducted with continuous monitoring of RF impedance while degrading the solder joints under test due to fatigue cracking. The test results showed the RF impedance consistently increased as the solder joints were degraded due to the growth of cracks, and particle filtering predicted the time to failure of the interconnects similarly to their actual timesto- failure based on the early sensitivity of RF impedance.
Abstract:Austenitic stainless steels are extensively used in mechanical engineering. The machined surface integrity has an essential influence on the stress corrosion cracking (SCC) performance of stainless steels. In this paper, the effects of multi-pass turning on the SCC susceptibility of AISI 304 austenitic stainless steel were investigated by correlating the SCC crack density to the machining-induced surface characteristics in terms of roughness, micro-hardness, and residual stress. In the multi-pass turning, the surface roughness and residual stress were the least after the double pass turning, and the surface micro-hardness was the maximum after the triple-pass turning. The SCC susceptibility was evaluated after SCC tests in boiling MgCl2 solution. The results showed that the weakest SCC sensitivity was observed in double-pass turning 304 stainless steel, while the most susceptible SCC was found in triple-pass turning. Compared with the double-pass turning, the increase in SCC sensitivity of triple-pass turning was attributed to the larger roughness, higher micro-hardness and greater residual tensile stresses.Keywords: multi-pass turning; austenitic stainless steel; roughness; micro-hardness; residual stress; stress corrosion cracking
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